Model: Dicing Saw 8003

Condition:Used

Price Terms:AS IS,WHERE IS,Advanced Payment. It is not tested or refurbished.We do not test or refurbish the system. They are sold *AS-IS WHERE IS*.We accept no responsibility or liability for the use and/or functionality of it.

Description:

The Thermocarbon ESEC 8003 is a high performance, multi-processor, fully programmable, precision wafer dicing saw. Based on dependable & accurate swiss mechanical features including:

-Precision control in Index, Rotation, & Stroke
-Powerful Teach Mode for fast programming & set-ups
-Advanced color camera & display system for precision measurements
-All cut parameters continuously displayed during cut
-Up to 100 stored programs
-Up to 12 steps per program
-Multi-axis measurement modes
-Automatic wear compensation
-Multi-depth cutting
-All features completely programmable
-continuous memory for all operating parameters & programs

Although this saw is extremely flexible & can be programmed to cut an unlimited variety of patterns, it is exceptionally easy to use and can be used in a production cutting environment.
The programming system allows you to set up cutting patterns of almost unlimited complexity with ease. Both index & rotation can be taught to the system. Dynamic compensation allows the user to correct for cumulative sub-micron drift in the materials being cut.

Advanced interlocks & features make the saw both easy & safe to use. These features include: auto vacuum, air pressure, over-temp, & vacuum loss detection, lighted emergency stop for low light operation, & extensive logic checks in the ROM based embedded software system.

Wafer Thickness: 10-5000 microns
Wafer Size: 25.4-152.4 mm
Dice Blade RPM: 15,000 to 45,000 RPM
Rotation Angle: 0.01 to 165 degrees
Index step: 20-99,999 microns
Feed Rate: 0.5 to 239 mm/sec
Flanges: 49mm & 51 mm
Voltage: 208-240 VAC +/-10 percent, 50/60 Hz max.
Air Pressure (air free of moisture and oil) 4.5 to 6 bar (64 to 85 psi)
Water Pressure: Up to 6 bar

Manufacturer: Dynatex

Condition:Used

Dynatex DX-III Scriber/Breaker

* Vintage: 1997

* Serial No. S/N 11174

* Windows 95 Operating System* Wafer type: GaAs, LINBo, Glass, InP, Silicon, Quartz ceramic

* wafer mounting: 7 inch hoop or metal saw frame

* Wafer size: 50 – 100 mm diameter.

* Wafer thickness: 40 um to 1250 um

* Indexing: 5 um – 100 mm

* Scribe method: Diamond tip

* Scribe channel width: < 5 um

* Scribe speed up to 75 mm/sec

* Break method: Impulse bar

* Break rate: 2 breaks per sec.* Programming features: Scribe force, scribe angle, approach speed, scribe speed, scribe extension, break force, multiple die size

Manufacturer: DynaTex

Condition:Used, AS IS(Refurbished system is optional)

Price:Best Offer

GST-150 SCRIBERBREAKER
.
PRODUCT BENEFITS
• More real estate and narrower street widths,
because Zero kerf loss allows higher die
density on the wafer
• Increased production rates
• Chip free results
• Less residual stress
• No toxic water discharge
• No D.I. water costs
PRODUCT FEATURES
Automatic
• Capable of completely and automatically
scribing and breaking many substrate
materials.
Cost effective
• Reduced production time
• System integration allows easy hook-up and
transport
• Superior yields and improved efficiency
Environmental
• No D.I. or toxic wastewater
Versatile
• Fully programmable for all scribing and
breaking parameters, including TrueAngle™
diamond tool positioning
• Infinitely programmable with Pentium™
powered Windows™ interface
Easy
• Stored Process eliminates operator
adjustments when changing between wafer
types
GST-150 SPECIFICATIONS
Wafer Size: 150mm max. (6″ max.)
Wafer Thickness: 40 um to 1725 um (material
dependant)
Minimum Die Size: 200 um square (dependent
on type of material and wafer thickness)
Minimum Wafer Index: 5 um with Std.
Encoders; 2 um with Optional Hi-Res.
Encoders
Maximum Wafer Index: 150 mm
Maximum Backside Metal: 10 um (dependent
on type of material and process)
Scribe Channel Width: < 5 um
Load Time: < 15 seconds
Alignment Time: < 30 seconds
Scribe Speed: 2 mm/sec to 100mm/sec
(0.080"/sec to 4 "/sec) (dependent on type of
material and process)
Break Rate: 2 breaks/sec. (depending on
substrate thickness and backside metals)
Break Method: Patented impulse bar
Vision System: Digital Hi-Res BW/Color
Camera; 17" Color Monitor; Pattern
Recognition System for Auto Alignment, Edge
Detection for automatic bar and piece
alignment, and Auto Step-Correction
Programmable: Scribe Tool Life; Scribe Angle;
Scribe Approach Speed; Scribe Force; Scribe
Speed; Scribe Extension; Break Force; Multiple
Die Size; Fiducial Image Storage; Wafer Type
and Profile; Multiple Wafer Profile Storage.
(Profile programmable in metric or imperial
units)
Wafer Mounting:Std: Metal Saw Frames (FF-
105 and FF-108); Optional: 7" or 6" Hoop Sets
(limits max. wafer size to 4" and 3")
Substrates: Saphire, GaAs, LiNbO3, Glass, InP,
GaP, Silicon, Quartz

Manufacturer:

Condition:Used,we sell it at AS IS.

Price:Best Offer

Fully Automatic Mounter for Wafers up to 8″

This fully automatic wafer mounter applies wafers to a dicing frame with adhesive tape(ELEP HOLDER).

•”Non-contact chuck method” which contacts only 3-4mm of the wafer edge (Contact chuck method also available)
•Integrated electrostatic eliminator
•Displays error messages with a LCD panel and work monitor
•Wafer ID management system (OCR/BCR/BCP) (optional)
•Safety Regulation SEMI S2 compliance
•SECS-I/II communication function (optional)

It is not tested or refurbished.It is sold *AS-IS WHERE IS*.We accepts no responsibility or liability for the use and/or functionality of the system.