DynaTex GST 150

Description

It is not tested or refurbished.It is sold *AS-IS WHERE IS*.We accepts no responsibility or liability for the use and/or functionality of the system.

Manufacturer: DynaTex

Condition:Used, AS IS(Refurbished system is optional)

Price:Best Offer

GST-150 SCRIBERBREAKER
.
PRODUCT BENEFITS
• More real estate and narrower street widths,
because Zero kerf loss allows higher die
density on the wafer
• Increased production rates
• Chip free results
• Less residual stress
• No toxic water discharge
• No D.I. water costs
PRODUCT FEATURES
Automatic
• Capable of completely and automatically
scribing and breaking many substrate
materials.
Cost effective
• Reduced production time
• System integration allows easy hook-up and
transport
• Superior yields and improved efficiency
Environmental
• No D.I. or toxic wastewater
Versatile
• Fully programmable for all scribing and
breaking parameters, including TrueAngle™
diamond tool positioning
• Infinitely programmable with Pentium™
powered Windows™ interface
Easy
• Stored Process eliminates operator
adjustments when changing between wafer
types
GST-150 SPECIFICATIONS
Wafer Size: 150mm max. (6″ max.)
Wafer Thickness: 40 um to 1725 um (material
dependant)
Minimum Die Size: 200 um square (dependent
on type of material and wafer thickness)
Minimum Wafer Index: 5 um with Std.
Encoders; 2 um with Optional Hi-Res.
Encoders
Maximum Wafer Index: 150 mm
Maximum Backside Metal: 10 um (dependent
on type of material and process)
Scribe Channel Width: < 5 um
Load Time: < 15 seconds
Alignment Time: < 30 seconds
Scribe Speed: 2 mm/sec to 100mm/sec
(0.080"/sec to 4 "/sec) (dependent on type of
material and process)
Break Rate: 2 breaks/sec. (depending on
substrate thickness and backside metals)
Break Method: Patented impulse bar
Vision System: Digital Hi-Res BW/Color
Camera; 17" Color Monitor; Pattern
Recognition System for Auto Alignment, Edge
Detection for automatic bar and piece
alignment, and Auto Step-Correction
Programmable: Scribe Tool Life; Scribe Angle;
Scribe Approach Speed; Scribe Force; Scribe
Speed; Scribe Extension; Break Force; Multiple
Die Size; Fiducial Image Storage; Wafer Type
and Profile; Multiple Wafer Profile Storage.
(Profile programmable in metric or imperial
units)
Wafer Mounting:Std: Metal Saw Frames (FF-
105 and FF-108); Optional: 7" or 6" Hoop Sets
(limits max. wafer size to 4" and 3")
Substrates: Saphire, GaAs, LiNbO3, Glass, InP,
GaP, Silicon, Quartz